大功率高亮度白光LED封装技术的研究

本文ID：17546

字数:9223,页数:18

论文编号:WLX021 字数:9223,页数:18

摘要

与传统光源相比，半导体光源具有节能、高效、体积小、寿命长、响应速度快、驱动电压低、抗振动等优点。用于照明的白光LED随着其管芯尺寸的加大，消耗功率的增加，在封装工艺方面都会产生一些独特的问题。白光LED的封装必须考虑多重因素的影响，其中散热条件、色度稳定性与均匀性是对LED性能影响最大的。对解决上述问题提出了一些方法，只要选择合适的封装材料，改进现有的器件结构。半导体光源正以新型固体光源的角色进入照明领域。特殊的控制工艺，就能解决大功率LED的散热与色度的均匀性问题。器件在适当散热的应用条件下，芯片的温度可以控制在75度以下，为延长LED的使用寿命奠定基础。

关键词：半导体光源大功率白光LED 封装散热

Abstract
Compared with traditional light sources,Semiconductor light source have the advantages of energy-saving, high efficiency, small size, long life, fast response and low driving voltage. For the white LED lighting with its die size increased and the increase in power consumption,there is some unique problems in packaging technology. White LED package must consider the impact of multiple factors,which thermal conditions and color stability and uniformity are the main factors. There are a number of ways To solve the problem, as long as the appropriate choice of packaging materials, and improve the existing structure of the device. Semiconductor light source is a solid source of new lighting. Special control of high-power LED technology could solve the heat and color problem. Under appropriate conditions, the chip can be controlled at 75 degrees below.It can expand the life of LED.

Keywords: Semiconductor light source High-power white LED
Packaging Dissemination of heat

目录
中文摘要i
英文摘要…ii
目录……iii
绪论
1.1 研究目的…… 1

1.2研究背景….1

1.3研究方法 1

1.4论文内容概述… 1… 1.4.

第二章 LED结构及发光原理
2.1二极管……2…1 ……………

2.2半导体的种类….2

2.3LED结构及发光原理….2

2.4白光的实现…3

第三章大功率LED封装热学设计
3.1器件的散热研究……4

3.2金属芯线路板……4

3.3大功率LED封装结构………5