ABSTRACT
Nickel-based filler is a new type of fillers, the mechanical, physical and welding performance can meet the electronic industry in the copper and low carbon steel welding. The solder to replace the traditional process DBAgCu50 filler used to reduce the cost and the purpose of section silver.
Production process in accordance with the transistor to replace the filler BAg50Cu new requirements, we have all kinds of alloy matrix made many experiments, the final choice of nickel as a filler matrix, such as the development of Ni-P-Cu ternary alloy can be better meet the requirements. Ni-P-Cu chemical composition (w%): P10-12; Cu10-20; Ni margin.
