THE RESEARCH OF BORON’S TLP DIFFUSION BONDING MECHANISM
ABSTRACT
Transient Liquid Phase (TLP) Bonding is finding use in applications which require high thermal, electrical, chemical and mechanical stability, such as in electrical connectors, turbine vanes and MMC's. Through the bonding, the melting point control is a very important step. Boron is a widely used element which has uncountable advantages as a melting point controller. Adding Boron into the bonding interlayer can depress the melting point easily, and it can improve the connecting quality. The research will using Fick equation to calculate their diffusion coefficient and activation energy in TLP diffusion bonding area of G128 alloys, and it will calculate the time of each step. We will discuss the TLP Diffusion Bonding Mechanism in two ways.